On November 17, Shengyi Electronics disclosed its intention to raise a maximum of 2.6 billion yuan through a private placement initiative. The proceeds from this fundraising effort will be strategically allocated to three key areas: firstly, they will be invested in the establishment of an HDI (High-Density Interconnect) production base dedicated to artificial intelligence computing; secondly, the funds will support the development of a high-multi-layer computing power circuit board project tailored for intelligent manufacturing applications; and lastly, a portion of the capital will be earmarked to bolster working capital reserves and facilitate the repayment of existing bank loans.
