The surge in shipments of high-end AI server products has spurred an expansion in upstream demand for printed circuit boards (PCBs). Copper-clad laminate producer ITEQ has announced that the M9-grade materials essential for next-generation AI data centers have successfully cleared certification processes in the latter half of 2025. Meanwhile, Tec-Hing KY is confident that its newly developed adhesive system, featuring a non-flow adhesive sheet, holds significant potential for application in AI-driven handheld and wearable devices.
