ASML Reveals Its Pioneering Advanced Packaging Lithography Machine with a Vast Field of View
1 week ago / Read about 0 minute
Author:小编   

At the 8th China International Import Expo, ASML, a renowned semiconductor equipment provider, took the opportunity to display a selection of its comprehensive lithography products and cutting-edge technologies. Among the showcased items were the DUV lithography machines, namely the TWINSCAN XT:260 and the TWINSCAN NXT:870B.

Notably, the TWINSCAN XT:260 stands out as the inaugural lithography system tailored specifically for the advanced packaging sector. Its innovative design, featuring a large field-of-view exposure, has the potential to dramatically enhance production efficiency, boosting it up to four times the original rate. Meanwhile, the TWINSCAN NXT:870B leverages upgraded optical components and a state-of-the-art magnetic levitation platform to achieve an impressive wafer output, exceeding 400 pieces per hour.