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On November 7, during an institutional survey, MTC revealed that its 25G DFB laser chips are now primed for large-scale production, while its 2.5G optical chips have also successfully completed the tape-out process. Presently, the company is pressing ahead with mass production efforts to ensure self-reliance in core raw materials. MTC has set its sights on introducing high-end products such as DFB chips with speeds of 50G and above, as well as CW light sources, by the year 2026. In tandem with these efforts, the company is actively exploring next-generation optical communication technology rooted in MicroLED, and is boosting its R&D investment in MicroLED optical interconnect technology. This strategic move is aimed at fulfilling the growing needs for low latency, high bandwidth, and low power consumption in AI deployment scenarios.
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