Search
Biwin Storage: Wafer-Level Advanced Packaging & Testing Project Gears Up for Production
2025-10-21 /
Read about 0 minute
Author：小编
Biwin Storage has announced that its wafer-level advanced packaging and testing project is now in the production preparation phase. Once fully operational, this initiative will offer customers an integrated, one-stop solution that merges "storage capabilities with wafer-level advanced packaging and testing services." This strategic move is poised to significantly bolster the company's core competitiveness within the realm of memory-computing integration. Presently, Tailai Technology—Biwin's Huizhou-based packaging and testing manufacturing hub—is operating at a high capacity utilization rate. To keep pace with escalating customer delivery requirements, the company is expediting efforts to expand the center's production capacity.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
