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According to two insiders well-versed in the situation, ChangXin Memory Technologies, a prominent Chinese memory chip manufacturer, is gearing up to launch an Initial Public Offering (IPO) on the Shanghai Stock Exchange as soon as the first quarter of 2026. The company is aiming for a valuation of up to RMB 300 billion (roughly equivalent to USD 42.12 billion). At present, ChangXin Memory Technologies is in the process of building an HBM (High-Bandwidth Memory) back-end packaging facility in Shanghai. The plant is expected to start production by the end of the following year, with an initial monthly production capacity of approximately 30,000 HBM wafers. Furthermore, the company has set its sights on achieving mass production of fourth-generation high-bandwidth memory, known as HBM3 chips, by 2026.
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