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Sitak: Self-Developed 3D SPI & 3D AOI Find Applications in Optical Communication
3 day ago /
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Author：小编
Sitak has announced that its independently developed 3D SPI (Solder Paste Inspection) and 3D AOI (Automated Optical Inspection) systems have seen extensive use within the optical communication sector. Specifically tailored for process inspections of optical module circuit boards, these systems boast the capability to substitute imported alternatives in cutting-edge semiconductor packaging procedures, aligning with global industry standards and practices.
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