According to reports from several South Korean media sources, such as Yonhap News Agency, on September 12, SK Hynix unveiled the successful completion of HBM4 development. HBM4 is an ultra-high-performance memory solution tailored for artificial intelligence (AI) applications. It has achieved the world's fastest data processing speed and highest energy efficiency, and for the first time, a mass production system has been established for it. When compared to its predecessor, HBM3E, HBM4 brings a host of improvements. It doubles the number of data transmission channels to 2048, doubles the bandwidth, operates at speeds surpassing 10Gbps (in contrast to the JEDEC standard of 8Gbps), and enhances energy efficiency by 40%. SK Hynix anticipates that this product can significantly boost the AI service performance of customer systems by up to 69%, while simultaneously cutting down on electricity costs for data centers. During the development phase, the company employed its proprietary MR-MUF packaging technology and the fifth-generation 10-nanometer-class DRAM process to guarantee the stability of mass production.