SK Hynix has declared the triumphant development of HBM4, an innovative, ultra-high-performance memory solution tailored for artificial intelligence (AI) applications. The company has also taken the pioneering step of setting up a system geared for large-scale production. HBM, a form of memory that stacks multiple DRAMs vertically, dramatically accelerates data processing, with six generations of such products already on the market. The latest HBM4 iteration doubles the number of data transmission channels and bandwidth, boosts energy efficiency by over 40%, and reaches unprecedented heights in terms of data processing speed and energy conservation.

Upon integrating HBM4, AI service performance can see an enhancement of up to 69%. This effectively tackles data bottlenecks, cuts down on power expenses in data centers, and operates at velocities that vastly outstrip JEDEC standards. The creation of this product leverages SK Hynix's proprietary cutting-edge MR-MUF technology and a fifth-generation 10-nanometer-class DRAM process, thereby minimizing the risks associated with mass production.