Song Bai's Research Team from the School of Mechanics and Engineering Science Makes Breakthrough: Achieves Embedded Microfluidic Cooling for Chips with Ultra-High Heat Flux Density
2 day ago / Read about 0 minute
Author:小编   

Electronic chips are the cornerstone of cutting-edge technology, underpinning not only the national economy and people's livelihoods but also national security. As chips in fields like high-performance computing, artificial intelligence, power electronics, and communication radar become more integrated and powerful, their heat generation density has skyrocketed. Some chips now have an average heat flux density on the order of kilowatts per square centimeter, with even higher localized values. This excessive heat generation not only degrades device performance, reduces reliability, and shortens the lifespan of the chips but also presents a significant challenge in terms of energy consumption. For example, data centers account for over 1% of global electricity consumption, with approximately 40% of that being used for thermal management.

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