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Samsung's HBM Exclusion from NVIDIA's Supply Chain, Focusing on Broadcom Partnership
2025-08-18 /
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Author：小编
Due to technical challenges in the second quarter of 2025, Samsung was unable to deliver its 12-layer HBM3E products to NVIDIA as scheduled, resulting in delivery delays. Meanwhile, its competitors, SK Hynix and Micron, have successfully secured supply contracts with NVIDIA, intensifying the competitive pressure on Samsung in the HBM market. Samsung is currently grappling with issues such as not meeting thermal dissipation standards, insufficient data transfer performance, and low yield rates, which have adversely affected its collaboration with NVIDIA. In response, Samsung has shifted its focus, aiming to begin supplying HBM3E products to Broadcom in the second half of 2025, with expectations of becoming Broadcom's largest supplier.
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