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Apple's upcoming iPhone 18 series is poised to introduce the groundbreaking A20 and A20 Pro chips, leveraging a cutting-edge 2nm process. According to Ming-Chi Kuo, an esteemed analyst at TF International Securities, Apple is in the midst of developing a novel packaging technology aimed at bolstering chip performance and streamlining costs. Notably, it is anticipated that the A20 chip will abandon the traditional InFO (Integrated Fan-Out) packaging by 2026, making way for TSMC's advanced WMCM (Wafer-Level Multi-Chip Module) packaging technology. This shift is expected to usher in substantial performance enhancements and cost efficiencies for the iPhone 18 series, though whether all models within the series will adopt this technology remains to be officially confirmed.
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