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Kuo Ming-Chi: Evergreen Emerges as TSMC's Premier Supplier of Advanced Packaging Materials
2025-08-13 /
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Author：小编
Ming-Chi Kuo, an analyst at TF International Securities, has issued a report revealing that Evergreen has triumphantly outpaced Japanese rivals Namics and Nagase, securing its position as TSMC's inaugural supplier of advanced packaging materials. Mass production is anticipated to commence in 2026. Additionally, Evergreen is poised to be the exclusive provider of advanced packaging materials for Apple's upcoming iPhone and Mac processors in 2026, furnishing MUF and LMC materials respectively. It is forecasted that by 2027-2028 at the earliest, Evergreen will become the sole or primary supplier of TSMC's CoWoS LMC.
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