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Apple Introduces A20 Processor with Revolutionary WMCM Packaging Technology in iPhone 18 Series
2025-08-13 /
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Author：小编
Renowned analyst Ming-Chi Kuo has disclosed that Apple intends to equip the iPhone 18 series, scheduled for release in 2026, with the groundbreaking A20 processor. This advanced processor will incorporate WMCM (Wafer-level Multi-Chip Module) packaging technology, marking a significant departure from the previous InFO packaging solution. WMCM technology facilitates the integration of components like the SoC and DRAM at the wafer level, thereby eliminating the necessity for interposer or substrate connections. This innovation not only enhances thermal performance but also minimizes material consumption and streamlines production processes, ultimately boosting production efficiency and yield.
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