Henggong Precision: Unveils Plans to Raise Up to 810 Million Yuan via Convertible Bonds for Cutting-Edge Projects, Including Intelligent Robot Development
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Author:小编   

Henggong Precision (301261.SZ) has officially declared its intention to issue convertible bonds to a yet-to-be-determined group of investors, aiming to secure a total fundraising amount capped at 810 million yuan. Following the deduction of issuance-related expenses, the proceeds will be strategically allocated to a range of forward-looking projects. These encompass the production of embodied intelligent robot bodies, the establishment of a pilot-scale production base and an R&D hub in Shanghai, the scaling up of high-end equipment component manufacturing, the expansion of new material capabilities for high-end components, as well as bolstering working capital reserves.