Zhen Ding Technology has made a significant announcement, revealing its intention to invest a staggering 10 billion yuan in the construction of a third park within Shenzhen. This state-of-the-art facility is set to become a smart manufacturing base dedicated to the production of high-end AI substrates and flexible circuit boards. The project is slated to commence in July 2026, with production expected to commence in 2033. The financial backing for this ambitious endeavor will come from a combination of the company's internal resources and funds raised independently. This strategic investment is designed to capitalize on the burgeoning opportunities presented by AI technology development. It will also bolster the company's strategic positioning across the entire AI ecosystem, encompassing the 'cloud, pipeline, and endpoint' chain. Furthermore, it aims to expand the company's operational scale and enhance overall efficiency, solidifying its position as a leader in the industry.