Zhen Ding Technology (002938) has announced its ambitious plan to allocate 10 billion yuan towards the establishment of a new, state-of-the-art third park in Shenzhen. This strategic investment aims to create an intelligent manufacturing hub dedicated to high-end AI-oriented substrate packages and flexible circuit boards. The project is slated to commence in July 2026 and is projected to reach completion and operational status by 2033. The funding for this endeavor will primarily come from the company's own reserves and self-raised capital.

This strategic move by Zhen Ding Technology is geared towards capitalizing on the burgeoning opportunities presented by the AI sector. By enhancing the full-chain layout of AI, encompassing "cloud, pipeline, and endpoint" technologies, the company aims to solidify its position in the market. Furthermore, this investment is expected to drive business expansion, scale up operations, and ultimately boost profitability, positioning Zhen Ding Technology as a frontrunner in the intelligent manufacturing landscape.