Single - Chip Solution Enables High - Speed Wireless Link Between Brain and AI
2025-12-11 / Read about 0 minute
Author:小编   

On December 11, 2025, a collaborative research team hailing from Columbia University, Stanford University, and the University of Pennsylvania made a groundbreaking announcement. They unveiled a novel brain - machine interface known as the Cortical Bio - Interface System (BISC).

This innovative device comes in the form of a single - chip implant, as thin as a sheet of paper. What sets it apart is its exceptionally high data transmission speed, which far surpasses that of existing technologies. This enables seamless and high - speed wireless connections between the human brain and artificial intelligence. The research findings have been published in the prestigious journal Nature Electronics.

The BISC chip boasts an incredibly thin profile, measuring just 50 micrometers in thickness. Its overall volume is a mere approximately 3 cubic millimeters, yet it packs an impressive 65,536 electrodes. In terms of data performance, its data throughput is at least 100 times greater than that of similar wireless devices currently available.

The high bandwidth and minimally invasive nature of the BISC chip bring new rays of hope for the treatment of various neurological disorders. These include epilepsy, spinal cord injuries, amyotrophic lateral sclerosis, stroke, and blindness. Moreover, it has the potential to serve as a foundational infrastructure for facilitating more direct and efficient collaboration between humans and artificial intelligence.

At present, the research team is actively pushing forward with the development of a commercial version of the BISC chip. This is in preparation for subsequent preclinical trials and eventual human applications.