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On April 15, Black Sesame Technologies unveiled a platform-level strategic collaboration with Dongfeng Motor Corporation. The Dongfeng Tianyuan Smart Cockpit Plus, an integrated cockpit and driving mass-production platform, will be powered by Black Sesame Technologies' cutting-edge Wudang C1296 chip. As the inaugural localized domestic integrated cockpit and driving mass-production platform, the Tianyuan Smart Cockpit Plus stands out for its ability to concurrently support intelligent cockpit functionalities, L2+ advanced driving assistance systems, and FAPA (Fully Automated Parking Assist) parking capabilities—all through a single chip. This platform will initially be integrated into the Dongfeng eπ007 model, with plans to expand its application across all Dongfeng models in the future. Continuous mass production is scheduled to commence from 2026 to 2027.
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