At present, the research on wearable electronics and compact medical monitoring devices primarily centers on the high-density, low-power, and miniaturized integration of multifunctional chips for "sensing-processing-communication". Nevertheless, traditional PCB integration approaches are hindered by their large footprint and substantial power consumption. Meanwhile, existing multi-chip modules and integrated fan-out packaging technologies are constrained by the heat dissipation issues associated with micro-bump bonding or epoxy resin substrates, posing challenges in achieving an optimal balance between size, cost, functional density, and thermal stability. Hence, the development of an innovative heterogeneous integration technology that combines high integration density, robust heat dissipation capabilities, and ultra-low power consumption is of immense academic importance and holds promising application potential.