Apple has secured a new patent focused on revolutionizing heat management within camera modules. This cutting-edge technology employs a dielectric liquid to efficiently absorb and dissipate the waste heat produced by critical components, such as image sensors and actuators. Specifically tailored for the compact confines of small camera modules, the design features a housing, lens assembly, movable substrate, image sensor, and a flexible seal. This flexible seal ingeniously partitions the internal space into two hermetically sealed chambers: one aligned along the optical path and the other situated outside it to house the dielectric liquid. This setup ensures an optimal equilibrium between efficient heat dissipation and superior imaging quality. Furthermore, the patent outlines a movable structure that prevents components from becoming immobile due to liquid expansion during heat absorption, thereby maintaining the camera's functionality and performance.