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On January 16th, industry analysts disclosed that Apple is poised to unveil its inaugural foldable smartphone, the iPhone Fold, in September of this year. This new device will debut alongside the iPhone 18 Pro and iPhone 18 Pro Max, all featuring the cutting-edge A20Pro chip. The A20Pro chip will be fabricated utilizing TSMC's state-of-the-art 2nm manufacturing process, which promises a 15% boost in performance and a 30% improvement in energy efficiency compared to its predecessor, the A19 chip. A notable innovation of the A20Pro chip is its adoption of WMCM (Wafer-Level Monolithic Chip Module) technology. This technology enables the seamless integration of memory directly onto the same wafer as the CPU, GPU, and NPU, thereby eliminating the previous need for a separate silicon interposer to position memory adjacent to the chip.
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