Recent whispers in the tech sphere suggest that Apple is gearing up to embrace TSMC's cutting-edge 2-nanometer process technology for its iPhone 18 lineup, slated for a 2026 debut, and will unveil two distinct chips: the A20 and the A20 Pro. This scoop comes courtesy of the Weibo account "Mobile Chip Expert," a Chinese social media source renowned for its past accuracy in unveiling Apple's chip-related strategies. The A20 chip is set to leverage TSMC's Wafer-Level Multi-Chip Module (WMCM) packaging prowess, enabling seamless heterogeneous integration of vital components like the CPU, GPU, and memory. This integration promises not only a boost in performance but also a reduction in power consumption. The iPhone 18 Pro series, along with its foldable counterparts, are expected to be the trailblazers, being the first to flaunt the A20 Pro chip, with the standard version models likely following in their footsteps at a later date.