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iFixit Disassembly Unveils Apple's Technique for Crafting the Ultra-Thin iPhone Air
2 day ago /
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Author：小编
In order to fit all the essential components into a mere 5.6mm-thick body, Apple ingeniously engineered a camera "plateau" design. A segment of the iPhone Air's main circuit board is ingeniously nestled within the camera protrusion. This clever arrangement not only optimizes space but also accommodates a sizeable battery encased in metal. Moreover, the strategic placement of the main circuit board ensures that the iPhone Air remains resilient against bending forces, safeguarding it from potential structural damage even in the event of bending. Furthermore, extensive testing has demonstrated that the device's titanium frame exhibits remarkable resistance to bending.
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