The sixth generation of wireless communication technology (6G) is set to revolutionize human-centric applications, including holographic communication, the tactile internet, and wearable wireless terminals. These advancements place new demands on communication terminals, requiring them to be high-speed, low-power, lightweight, and flexible enough to attach seamlessly to the body. Flexible radio frequency devices operating at frequencies exceeding 100 GHz are essential for building these advanced terminals. Nevertheless, the inherently low thermal conductivity of flexible polymer substrates poses a significant challenge. Under high current density and frequency conditions, these devices are prone to self-heating effects, which can degrade their radio frequency performance and compromise their long-term reliability. Therefore, achieving a harmonious balance of high frequency, low power consumption, and efficient thermal management on flexible platforms remains a formidable challenge in the field of flexible radio frequency transistors.