From July 9 to 11, Zhengzhou played host to the 2026 Intelligent Computing Application Conference of the Heterogeneous Computing Organization. During this event, Hygon Information made a striking debut by presenting its comprehensive "cloud-edge-device" computing power system for the very first time.

At the exhibition area, an array of physical AI platforms and products were on display. These included intelligent inspection robots powered by Hygon C86 chips, AI BOX edge all-in-one machines, and EtherCAT high-precision motion control solutions. These offerings catered to a diverse range of scenarios, encompassing industrial control and precision manufacturing. The secret behind these innovative solutions lies in Hygon's dual-chip synergy between CPUs and DCUs, complemented by embedded native AI technology.

Moreover, the conference witnessed a historic moment with the official launch of China's first fully domestically produced AI supercluster boasting 100,000 cards—the Sugon 8000 (Dengfeng). This groundbreaking achievement was made possible by leveraging domestic chips, with Hygon chips serving as the cornerstone of its computing prowess.