The research report released by CITIC Construction Investment highlights that the expansion of the computing power sector has significantly elevated chip integration and power density. This trend has pushed traditional copper-based heat dissipation materials to their operational limits under high heat flux conditions. Diamond, boasting a thermal conductivity far superior to that of copper and silver, has emerged as the linchpin for overcoming the heat dissipation bottleneck in high-end chips.

At present, diamond-based heat dissipation materials predominantly follow three technological pathways: diamond-based composites, single-crystal diamond, and polycrystalline diamond. However, none of these routes have achieved full standardization yet. Among them, diamond-copper composite materials strike an optimal balance between performance and cost, paving the way for their leading role in industrialization.

In terms of applications, diamond-based heat dissipation materials manifest in various forms, including diamond substrates, heat sinks, and microchannel heat dissipation systems. Notably, heat sinks and diamond-copper composite materials are witnessing the swiftest commercialization, with relevant products already being offered by both domestic and international manufacturers.

Diamond is undergoing a transformative expansion from its traditional applications in abrasives and cultivated diamonds to functional materials for semiconductors and thermal conduction in high-power devices. The burgeoning growth of AI computing power is continuously propelling the expansion of the market for ultra-high thermal conductivity diamond materials. Consequently, the progress in industrial mass production and customer certification for these materials warrants close and ongoing attention.