On December 23, CITIC Securities released a research report indicating that, beginning in 2025, the substantial surge in power consumption of AI servers and escalating chip power requirements will drive liquid cooling solutions to the forefront. Owing to their exceptional heat dissipation efficiency and low Power Usage Effectiveness (PUE), these solutions are poised to become the leading technological approach for energy conservation and consumption reduction in data centers. It is anticipated that, with the rapid adoption of liquid cooling technology and the rise in Average Selling Price (ASP) due to technological advancements, the global liquid cooling market will soar to US$21.8 billion by 2027. Presently, the liquid cooling industry chain is predominantly led by Taiwanese manufacturers. Nevertheless, as chip manufacturers increasingly engage in the selection process of the liquid cooling supply chain, domestic manufacturers are set to seize substantial growth opportunities. CITIC Securities expresses optimism that domestic manufacturers will fully capitalize on the burgeoning demand for AIDC liquid cooling and recommends manufacturers capable of mass-producing core liquid cooling components and offering comprehensive solutions.