On December 22, Jinpan Technology made a public announcement, revealing that the total funds to be raised through this convertible bond issuance would amount to 1.672 billion yuan. After accounting for and deducting the issuance expenses, the net proceeds will be channeled into two significant projects.

The first project is the Smart Manufacturing Initiative for Data Center Power Modules and High-Efficiency, Energy-Saving Power Equipment. Once fully completed and operational, this project is anticipated to boost annual production capacity by 1,200 sets of a comprehensive product range. This includes data center power modules (comprising 19,000 medium and low-voltage switchgear units) and 4.1 million kVA of VPI transformers.

The second endeavor is the Smart Manufacturing Project for High-Efficiency, Energy-Saving Liquid-Immersed Transformers and Amorphous Alloy Cores. Upon reaching full operational status, this project is projected to increase the annual production capacity by 15.78 million kVA of liquid-immersed transformers, featuring both amorphous alloy cores and silicon steel three-dimensional wound cores.