Huatech to Launch RMB 2 Billion Wholly-Owned Subsidiary Dedicated to 2.5D/3D IC Packaging and Testing
1 day ago / Read about 0 minute
Author:小编   

Huatech announces plans to establish Nanjing Huatech Advanced Packaging Co., Ltd., a wholly-owned subsidiary with an investment of RMB 2 billion. This new entity will be solely focused on 2.5D and 3D IC packaging and testing services. By taking this step, Huatech aims to capture the early-mover advantage in the advanced packaging market and further bolster its overall competitive stance.