TSMC Delays Production Start for Second Kumamoto Wafer Fab to First Half of 2029

3 week ago / Read about 0 minute

Author：小编

TSMC's second wafer fabrication facility in Kumamoto, Japan, has encountered a delay in its production startup, now scheduled for the first half of 2029, as opposed to the initial plan of late 2027. Construction is anticipated to commence in the second half of 2025. Meanwhile, the first Kumamoto fab successfully achieved mass production by the end of 2024, with a primary focus on automotive logic chips and image sensors. The postponement is primarily due to geopolitical factors and local infrastructure challenges, highlighting the intricate landscape of the global semiconductor supply chain reorganization.

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