On June 27th, Ren Zhengfei issued an internal appointment naming He Tingbo, the former President of Huawei's Semiconductor Business Unit, as the concurrent head of Huawei's Senior Talent Compensation Department. This announcement was made within Huawei on July 1st. Since joining the company in 1996, He Tingbo has accumulated extensive experience across various technical and managerial roles, notably making significant contributions to chip research and development as well as the growth of Hisilicon. In 1998, she spearheaded the establishment of Huawei's Shanghai Wireless Chip Team and successfully navigated Hisilicon through US sanctions in 2019, safeguarding the strategic security and supply chain stability of Huawei products. The Senior Talent Compensation Department, established in 2021 under the Human Resources Department, is responsible for devising compensation packages for top-tier talents. He Tingbo's concurrent role underscores Huawei's profound commitment to attracting and retaining talent in the semiconductor industry.