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Kickoff of Xinde Technology's 5.5 Billion Yuan Advanced AI Packaging and Testing Base Project
1 week ago /
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Author：小编
On June 30, the groundbreaking ceremony for Xinde Technology's state-of-the-art AI packaging and testing base project took place in Nanjing, marking an investment totaling 5.5 billion yuan. Phase one of the project, with an investment of 1 billion yuan, is anticipated to achieve full production capacity, yielding 18,000 units of 2.5D packaging products and 300 million wafer-level high-density chip packaging products annually.
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