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TSMC Prioritizes AI and HPC with CoPoS Packaging Technology; Plans Pilot Line for 2026
2025-06-11 /
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Author：小编
In 2026, TSMC intends to establish its inaugural pilot line for CoPoS packaging technology at its subsidiary, TSMC Taiwan. The location for mass production has been designated as AP7 in Chiayi, with operations anticipated to commence between late 2028 and 2029. CoPoS technology is specifically tailored for advanced applications, notably AI, aiming to maximize the spindle's usable space through innovative square packaging and minimize costs.
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