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NAFMII Reports: Over RMB 370 Billion Issued in Technological Innovation Bonds in Inaugural Month
5 day ago /
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Author：小编
Within the first month of the launch of technological innovation bonds, an impressive total of over RMB 374.8 billion was issued by 147 institutions across various market sectors. Specifically, financial institutions contributed RMB 223.9 billion, whereas non-financial enterprises issued RMB 151 billion. Notably, the National Association of Financial Market Institutional Investors (NAFMII) extended tailored support to non-financial enterprises, significantly aiding in the issuance of RMB 97.72 billion.
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