Samsung's pursuit of certification for its innovative 12-layer HBM3E memory has encountered unforeseen delays, potentially postponing NVIDIA's approval until the fourth quarter of 2025. HBM3E, which is pivotal in high-performance computing and AI accelerators, promises unparalleled performance and capacity due to its advanced 12-layer stacking technology. However, Samsung faces technical hurdles in perfecting this cutting-edge memory. In an effort to secure orders, the company had previously revamped its DRAM architecture. Nevertheless, the data transfer speeds have yet to meet NVIDIA's stringent requirements, resulting in the delay of certification. This setback is expected to exacerbate Samsung's competitive stance in the HBM market.