In the investor relations activity record, Sugon disclosed that United States sanctions pose significant challenges to the company's operations. To address these challenges, Sugon plans to elevate its R&D expenditures and bolster its independent research and development capabilities. Particularly in the realm of localization, the company aims to diversify its product offerings and increase the share of high value-added service revenue. Simultaneously, Sugon will establish a comprehensive information technology infrastructure, spanning from the bottom layer to the application layer, thereby enhancing the industrial ecosystem. Furthermore, Sugon and Hygon will merge to collaboratively invest in the R&D of high-end chips and solutions. This merger will strengthen customer satisfaction with integrated technical solutions, accelerate the widespread adoption of domestic chips in crucial industries such as government, finance, communications, and energy, and ultimately contribute to the robust development of China's information technology industry.