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TSMC's Zhang Xiaoqiang: AI Fuels Demand for Future Cutting-Edge Processes and Packaging
2025-05-15 /
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Author：小编
At the 2025 Technology Forum held in Taiwan on May 15, Zhang Xiaoqiang, Senior Vice President of Business Development and Global Business at TSMC, highlighted that artificial intelligence (AI) is propelling the demand for future 5nm, 4nm, 3nm, and even more advanced process nodes and packaging technologies. With over 30 years of experience in the industry, he noted that the semiconductor sector is currently witnessing an era of unprecedented excitement and transformation.
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