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Lingang Unveils Design Blueprint for Xinsheng Semiconductor's 300mm Silicon Wafer Initiative
2025-04-30 /
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Author：小编
On April 30, 2025, the Lingang Management Committee revealed the design blueprint for Shanghai Xinsheng Semiconductor Technology Co., Ltd.'s "300mm Silicon Wafer Research, Development, and Industrialization Project for Integrated Circuit Manufacturing, along with an Ancillary R&D Project for Integrated Circuit Silicon Material Engineering." Shanghai Xinsheng, a wholly-owned subsidiary of the Shanghai Silicon Industry Group, is a leading producer of 300mm semiconductor silicon wafers. The project, set to be established in Nicheng Town, Pudong New Area, aims to bolster China's expertise in silicon material engineering research and application.
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