Search
UMC and Intel's 12nm Process Collaboration Advances Steadily, Targeting 2027 Production with Enhanced Performance
2025-04-29 /
Read about 0 minute
Author：小编
The joint development of the 12nm process by United Microelectronics Corporation (UMC) and Intel is progressing seamlessly, showcasing remarkable enhancements in power consumption, performance, and area—the three core metrics—in comparison to the 14nm process. This process is forecasted to complete verification in 2026 and commence official production in 2027. Furthermore, UMC has achieved a significant breakthrough in advanced packaging technology with its wafer-level 3D W2W hybrid bonding solution, which is set for mass production within this year. This development will further bolster UMC's competitive position in the semiconductor industry.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
