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Apple's Upcoming High-End M5 Processor Rumored to Embrace TSMC's SoIC Packaging
2025-04-28 /
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Author：小编
Taiwan Semiconductor Manufacturing Company (TSMC) has made strides in the development of its advanced SoIC (System on Integrated Chip) packaging technology, with Apple playing a pivotal role in driving its adoption. For those unacquainted with SoIC packaging technology, it stands apart from SoC (System on a Chip) and is anticipated to feature in Apple's upcoming high-end M5 chip in the latter half of this year. SoIC technology revolutionizes chip integration by seamlessly blending multiple chips in a three-dimensional space through innovative interconnect methods. This approach not only significantly enhances system integration and performance but also minimizes power consumption and package dimensions.
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