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SpaceX, a Major Player in Panel-Level Packaging, Rumored to Establish Its Own 700x700mm Production Line
2025-04-21 /
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Author：小编
The semiconductor industry is undergoing a shift from round packaging to square packaging. Industry insiders suggest that, alongside industry giants like TSMC and Intel, SpaceX is poised to enter the realm of panel-level packaging. The company reportedly plans to construct its own 700x700mm packaging production line, injecting fresh impetus into the panel-level packaging sector. This line will represent the largest scale currently in mass production on the market, and SpaceX anticipates procuring equipment from manufacturers within this year.
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