Search
TSMC Expands Facilities for Advanced Packaging Across Taiwan, Highlighting Southern Taiwan Science Park
2025-01-20 /
Read about 0 minute
Author：小编
On January 20, TSMC announced an ambitious expansion plan in response to the burgeoning demand for advanced packaging technology. The company will augment its facilities at various locations across Taiwan, with a notable focus on the construction of two CoWoS (Chip on Wafer on Substrate) advanced packaging factories at the third phase of the Southern Taiwan Science Park. This strategic move underscores TSMC's commitment to reinforcing its leadership in the advanced packaging sector, elevating chip performance, and catering to the evolving needs of sophisticated electronic products.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
