On August 26, 2024, Beijing Northern Microelectronics Equipment Co., Ltd. announced the publication of a patent under the title 'Method for Forming Trench Structure, Removing By-products in Trench, and Wafer Carrier Device,' with the publication number CN119132945A. This groundbreaking patent employs a uniquely engineered wafer carrier device to maintain the wafer at an inclined angle within the process chamber. This technique effectively eliminates by-products from trench sidewalls, minimizes trench sidewall roughness, and significantly enhances the precision of semiconductor manufacturing processes.
