Search
New Tsinghua Unigroup and BAIC Group Strengthen Cooperation to Drive Integration of Automotive Chip R&D and Vehicle Applications
11 hour ago /
Read about 0 minute
Author：小编
New Tsinghua Unigroup and BAIC Group have unveiled a joint innovation center and signed an agreement to deepen their cooperation in Beijing. Under the agreement, the two parties will enhance collaboration in areas such as SoC chips, cockpit-driving integrated domain control, intelligent cockpits, and intelligent chassis domain control, advancing the deep integration of automotive chip research and development with vehicle applications.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
