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BAIC and Unisplendour's Joint Chip Project Targets Mass Production and Vehicle Integration by 2028
20 hour ago /
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Author：小编
On November 13, the BAIC Research Institute and Tongxin Microelectronics signed a chip cooperation agreement to jointly develop an automotive-grade cockpit-driving-control integrated SoC chip. The chip is designed to achieve single-chip computing power of 1,000 TOPS, with the goal of mass production and integration into the first-launch vehicle model by 2028.
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