ACM Research Shanghai Dispatches Its Inaugural Mass-Production Panel-Level Horizontal Electroplating System to an Asian Client - Chip

7 x 24 Track global technological trends

Hot Topic

Day

News Topic

ACM Research Shanghai Dispatches Its Inaugural Mass-Production Panel-Level Horizontal Electroplating System to an Asian Client

9 hour ago / Read about 0 minute

Author：小编

On October 29, 2026, ACM Research Shanghai proudly declared the triumphant dispatch of its pioneering mass-production 310×310mm panel-level horizontal electroplating system, dubbed UltraECP ap-p, to an Asian market beyond mainland China. This system harnesses the power of independently-developed horizontal electroplating technology and accommodates a diverse range of multi-material electroplating processes, encompassing copper, nickel, tin-silver, and gold. This achievement signifies a monumental leap forward for ACM Research Shanghai within the realm of core panel technology.

Previous page：NovaSensor Shines at 2026 World Intelligent Connec...

Next page：Hang Seng Index Opens 0.03% Lower, Hang Seng Tech ...

Return to List

Hot Reading

1 day ago

Two AI Systems Disproved Same Complexity Conjecture Independently on Same Day: 800 Papers at Risk

2 day ago

What Anthropic’s S-1 Reveals About Data Centers, Chips and Networking

3 day ago

MViSTA Cable Bans China as US Rewires Southeast Asia's Digital Backbone

2 day ago

The Baltic Bloc Is Now Complete: Latvia Clears Tesla Assisted Driving, Setting Up a December EU Showdown