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ACM's First Mass-Production 310×310mm Panel-Level Horizontal Electroplating Equipment Successfully Shipped to Asian Customer
16 hour ago /
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Author：小编
ACM Research (Shanghai), Inc. (Stock Code on the STAR Market: 688082) is a supplier of wafer processing solutions for semiconductor front-end and advanced packaging applications. Today, the company announced that its first mass-production 310mm×310mm panel-level horizontal electroplating equipment, UltraECP ap-p, has been successfully shipped to an Asian market outside of mainland China. This milestone not only highlights ACM Shanghai's breakthrough in core panel technologies but also marks a significant step forward in its strategy of product platformization and customer globalization.
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