ChangXin Memory Technologies to Initiate HBM3E Mass Production by Year-End: A Key Step Forward for China's AI Memory Industry
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Author:小编   

Chinese memory chip enterprise ChangXin Memory Technologies plans to officially commence mass production of HBM3E high-bandwidth memory by the end of 2026. This move marks the first entry of a Chinese domestic manufacturer into the advanced HBM market and is regarded as a significant milestone in enhancing China's self-sufficiency in the AI industry supply chain. ChangXin Memory Technologies has already sent samples to several domestic AI chip design companies and anticipates initiating small-scale production within the next two months. Despite currently lower yield rates compared to international leaders, its mass production plan is still expected to alleviate supply pressures on critical memory chips for China's AI industry.