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During the earnings call, an executive from SK Hynix announced that, for the present, the company will make full use of the cost-effective 6F² architecture, which has already commenced mass production. Subsequently, the company will smoothly transition to the 4F² or 3D DRAM platform in due course. SK Hynix is already equipped with the ability to expand its current architecture platform through the miniaturization achieved via the EUV process and technological advancements. At this juncture, the company's most effective approach is to bolster product competitiveness by relying on well-established and mature mass production platforms. When introducing new-generation technologies, the company will take into account a comprehensive range of factors, including performance, yield, cost, product design, and customer certification.
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